Description

DIAMOND WIRE SAW
DW 291 is de­signed for slic­ing mono- and mul­ticrys­talline sil­i­con wafers for the pho­to­voltaic in­dus­try.

New DW 291 sets in­dus­try stan­dards for fastest wafer cut­ting times. DW 291 de­liv­ers a com­pre­hen­sive set of in­no­va­tions to fur­ther in­crease wafer out­put. The patented Di­a­mond Wire Man­age­ment Sys­tem (DWMS) en­sures a longer ser­vice life thanks to re­sharp­en­ing tech­nol­ogy and ex­tended wind­ing fea­ture.

Longer web length as well as higher wire speed and ac­cel­er­a­tion en­able an in­creased through­put per ma­chine and year. Usage of ul­tra-thin di­a­mond wire is pos­si­ble as a re­sult of op­ti­mized in­er­tia of mov­ing parts, shorter wire path and Di­a­mond Wire Man­age­ment Sys­tem (DWMS).