Ad ID: 713
Added: August 17, 2018
Phone: 91 20 6900 0208
DIAMOND WIRE SAW
DW 291 is designed for slicing mono- and multicrystalline silicon wafers for the photovoltaic industry.
New DW 291 sets industry standards for fastest wafer cutting times. DW 291 delivers a comprehensive set of innovations to further increase wafer output. The patented Diamond Wire Management System (DWMS) ensures a longer service life thanks to resharpening technology and extended winding feature.
Longer web length as well as higher wire speed and acceleration enable an increased throughput per machine and year. Usage of ultra-thin diamond wire is possible as a result of optimized inertia of moving parts, shorter wire path and Diamond Wire Management System (DWMS).